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AS4C64M32MD2-25BCNTR

AS4C64M32MD2-25BCNTR

Product Overview

Category

AS4C64M32MD2-25BCNTR belongs to the category of semiconductor memory products.

Use

It is primarily used as a storage component in electronic devices such as computers, smartphones, and other digital systems.

Characteristics

  • High storage capacity: AS4C64M32MD2-25BCNTR offers a large storage capacity, allowing for the storage of a significant amount of data.
  • Fast data access: It provides quick access to stored data, ensuring efficient performance.
  • Low power consumption: The product is designed to consume minimal power, making it energy-efficient.
  • Compact package: AS4C64M32MD2-25BCNTR comes in a compact package, enabling easy integration into various electronic devices.
  • Reliable performance: It offers reliable and stable performance, ensuring data integrity.

Package and Quantity

AS4C64M32MD2-25BCNTR is typically packaged in a small form factor, such as a surface-mount package. The exact package type may vary depending on the manufacturer. It is usually available in bulk quantities suitable for mass production.

Specifications

  • Model: AS4C64M32MD2-25BCNTR
  • Memory Type: Dynamic Random Access Memory (DRAM)
  • Capacity: 64 Megabits (Mb) or 8 Megabytes (MB)
  • Organization: 32M words x 16 bits
  • Operating Voltage: 2.5V
  • Speed: 25 nanoseconds (ns)
  • Interface: Parallel
  • Package Type: Surface Mount
  • Temperature Range: Commercial (0°C to +70°C)

Detailed Pin Configuration

The pin configuration of AS4C64M32MD2-25BCNTR may vary depending on the specific package and manufacturer. However, a typical pin configuration for this product includes the following pins:

  1. VDD: Power supply voltage
  2. VSS: Ground reference
  3. A0-A24: Address inputs
  4. DQ0-DQ15: Data input/output lines
  5. WE: Write enable
  6. CAS: Column address strobe
  7. RAS: Row address strobe
  8. OE: Output enable
  9. CLK: Clock input
  10. NC: No connection

Note: This is a simplified representation of the pin configuration. Please refer to the datasheet provided by the manufacturer for the complete and accurate pinout information.

Functional Features

  • Random Access: AS4C64M32MD2-25BCNTR allows random access to stored data, enabling quick retrieval and modification.
  • Refresh Operation: It incorporates an internal refresh mechanism to maintain data integrity over time.
  • Low Power Standby Mode: The product supports a low-power standby mode, reducing power consumption when not in use.
  • Burst Mode: AS4C64M32MD2-25BCNTR offers burst mode operation, allowing for faster data transfer during consecutive memory accesses.

Advantages and Disadvantages

Advantages

  • High storage capacity enables the storage of large amounts of data.
  • Fast data access ensures efficient performance.
  • Low power consumption makes it energy-efficient.
  • Compact package facilitates easy integration into electronic devices.
  • Reliable performance ensures data integrity.

Disadvantages

  • Limited temperature range may restrict its use in extreme environments.
  • Requires periodic refresh operations to maintain data integrity.

Working Principles

AS4C64M32MD2-25BCNTR operates based on the principles of dynamic random access memory (DRAM). It stores data as electrical charges in tiny capacitors within the memory cells. These charges need to be periodically refreshed to prevent data loss. When data is accessed, the memory controller sends appropriate signals to select the desired row and column, allowing the data to be read or written.

Detailed Application Field Plans

AS4C64M32MD2-25BCNTR finds applications in various electronic devices and systems, including: - Personal computers - Laptops and notebooks - Servers - Smartphones and tablets - Gaming consoles - Networking equipment - Industrial automation systems - Automotive electronics

Alternative Models

There are several alternative models available in the market that offer similar functionality and specifications as AS4C64M32MD2-25BCNTR. Some of the notable alternatives include: - AS4C64M32MD2-25BIN - AS4C64M32MD2-25BCTR - AS4C64M32MD2-25BCN

These alternative models may vary in terms of package type, temperature range, or other minor specifications. It is recommended to consult the manufacturer's datasheets for detailed information on each alternative model.

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قم بإدراج 10 أسئلة وإجابات شائعة تتعلق بتطبيق AS4C64M32MD2-25BCNTR في الحلول التقنية

  1. Question: What is the capacity of the AS4C64M32MD2-25BCNTR memory module?
    Answer: The AS4C64M32MD2-25BCNTR has a capacity of 64 megabits (Mb) or 8 megabytes (MB).

  2. Question: What is the operating voltage range for this memory module?
    Answer: The AS4C64M32MD2-25BCNTR operates at a voltage range of 2.3V to 2.7V.

  3. Question: What is the clock frequency supported by this memory module?
    Answer: The AS4C64M32MD2-25BCNTR supports a clock frequency of up to 250 MHz.

  4. Question: Is this memory module compatible with DDR3 or DDR4 interfaces?
    Answer: No, the AS4C64M32MD2-25BCNTR uses a DDR2 interface.

  5. Question: Can this memory module be used in both commercial and industrial applications?
    Answer: Yes, the AS4C64M32MD2-25BCNTR is suitable for both commercial and industrial applications.

  6. Question: What is the access time of this memory module?
    Answer: The AS4C64M32MD2-25BCNTR has an access time of 25 nanoseconds (ns).

  7. Question: Does this memory module support ECC (Error Correction Code)?
    Answer: No, the AS4C64M32MD2-25BCNTR does not support ECC.

  8. Question: What is the package type of this memory module?
    Answer: The AS4C64M32MD2-25BCNTR comes in a 90-ball BGA (Ball Grid Array) package.

  9. Question: Can this memory module be used in automotive applications?
    Answer: Yes, the AS4C64M32MD2-25BCNTR is suitable for automotive applications.

  10. Question: What is the temperature range within which this memory module can operate?
    Answer: The AS4C64M32MD2-25BCNTR has an operating temperature range of -40°C to +85°C.