CY7C1079DV33-12BAXI

Product Overview

Category

The CY7C1079DV33-12BAXI belongs to the category of integrated circuits (ICs), specifically a synchronous static random-access memory (SRAM) chip.

Use

This IC is primarily used as a high-speed, low-power memory solution in various electronic devices and systems. It provides fast read and write access times, making it suitable for applications that require quick data retrieval and storage.

Characteristics

• High-speed operation: The CY7C1079DV33-12BAXI offers fast access times, allowing for efficient data processing.
• Low power consumption: This IC is designed to minimize power usage, making it suitable for battery-powered devices.
• Large storage capacity: With a capacity of [specify capacity], it can store a significant amount of data.
• Synchronous interface: The SRAM operates synchronously with the system clock, ensuring reliable data transfer.

Package

The CY7C1079DV33-12BAXI is available in a compact and industry-standard package, such as a 48-pin TSOP (Thin Small Outline Package). This package ensures easy integration into circuit boards and facilitates efficient heat dissipation.

Essence

The essence of the CY7C1079DV33-12BAXI lies in its ability to provide high-speed and low-power memory functionality, enabling efficient data storage and retrieval in electronic systems.

Packaging/Quantity

The CY7C1079DV33-12BAXI is typically packaged in reels or trays, depending on the manufacturer's specifications. The quantity per package may vary, but a common configuration includes 250 units per reel/tray.

Specifications

• Operating voltage: 3.3V
• Access time: 12 ns
• Organization: [specify organization]
• Data retention: [specify data retention]
• Operating temperature range: -40°C to +85°C
• Package type: 48-pin TSOP

Detailed Pin Configuration

The CY7C1079DV33-12BAXI features a 48-pin configuration with the following pin assignments:

1. [Pin 1 description]
2. [Pin 2 description]
3. [Pin 3 description] ...
4. [Pin 48 description]

For a detailed pin diagram, refer to the datasheet provided by the manufacturer.

Functional Features

• High-speed operation: The SRAM chip offers fast access times, allowing for quick data retrieval and storage.
• Low power consumption: It is designed to minimize power usage, making it suitable for energy-efficient applications.
• Synchronous interface: The IC operates synchronously with the system clock, ensuring reliable data transfer.
• Easy integration: The compact package and standard pin configuration facilitate seamless integration into electronic systems.

Advantages and Disadvantages

Advantages

• Fast access times enable efficient data processing.
• Low power consumption prolongs battery life in portable devices.
• Large storage capacity accommodates substantial amounts of data.
• Synchronous interface ensures reliable data transfer.

Disadvantages

• Limited availability of alternative models may restrict design flexibility.
• Higher cost compared to other memory technologies.

Working Principles

The CY7C1079DV33-12BAXI operates based on the principles of synchronous static random-access memory. It stores data in a matrix of memory cells, which can be accessed and modified through specific address and control signals. The synchronous interface allows for synchronized data transfer between the IC and the system, ensuring accurate and reliable operation.

Detailed Application Field Plans

The CY7C1079DV33-12BAXI finds application in various fields, including:

1. Telecommunications: Used in networking equipment, routers, and switches for fast data buffering.
2. Consumer electronics: Integrated into smartphones, tablets, and gaming consoles to provide high-speed memory for efficient data processing.
3. Automotive systems: Employed in automotive infotainment systems and advanced driver-assistance systems (ADAS) for quick data storage and retrieval.
4. Industrial automation: Utilized in industrial control systems and robotics for real-time data handling.

Detailed and Complete Alternative Models

1. [Alternative Model 1]: [Brief description]
2. [Alternative Model 2]: [Brief description]
3. [Alternative Model 3]: [Brief description]

Please refer to the manufacturer's documentation for a comprehensive list of alternative models available in the market.

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