CY7C1413KV18-250BZC

Product Overview

Category

The CY7C1413KV18-250BZC belongs to the category of high-performance synchronous SRAM (Static Random Access Memory) chips.

Use

This product is primarily used in applications that require fast and reliable data storage and retrieval. It is commonly employed in various electronic devices such as computers, servers, networking equipment, and telecommunications systems.

Characteristics

• High Performance: The CY7C1413KV18-250BZC offers fast access times and low latency, making it suitable for time-critical operations.
• Large Capacity: With a capacity of 1,048,576 bits (128K x 8), this chip provides ample storage space for data-intensive applications.
• Low Power Consumption: The device is designed to operate efficiently, minimizing power consumption and extending battery life in portable devices.
• Wide Operating Voltage Range: The chip supports a voltage range of 1.7V to 2.0V, allowing compatibility with various power supply configurations.
• Robust Packaging: The CY7C1413KV18-250BZC is packaged in a BGA (Ball Grid Array) package, which ensures secure connections and protects the internal components from external factors such as moisture and physical damage.

Packaging/Quantity

The CY7C1413KV18-250BZC is typically available in reels or trays, depending on the manufacturer's packaging standards. The exact quantity per package may vary, but it is commonly supplied in quantities of 100 or more.

Specifications

• Organization: 128K x 8 bits
• Access Time: 18 ns
• Operating Voltage: 1.7V - 2.0V
• Package Type: BGA
• Temperature Range: -40°C to +85°C
• Data Retention: 10 years

Detailed Pin Configuration

The CY7C1413KV18-250BZC features a standard pin configuration, as follows:

1. VDD (Power Supply)
2. DQ0-DQ7 (Data Input/Output)
3. A0-A16 (Address Inputs)
4. WE# (Write Enable)
5. OE# (Output Enable)
6. CE# (Chip Enable)
7. UB#, LB# (Upper Byte, Lower Byte Control)
8. CLK (Clock Input)
9. VSS (Ground)

Functional Features

• Asynchronous and Synchronous Operation: The chip supports both asynchronous and synchronous modes of operation, providing flexibility in different system configurations.
• Burst Mode: It offers burst read and write operations, allowing for efficient data transfer between the memory and the processor.
• Automatic Power Down: The device includes a power-down feature that reduces power consumption when the memory is not actively accessed, further enhancing energy efficiency.
• Error Correction Code (ECC): The CY7C1413KV18-250BZC incorporates ECC functionality to detect and correct errors, ensuring data integrity.

Advantages and Disadvantages

Advantages

• High-performance access times enable rapid data retrieval.
• Large storage capacity accommodates data-intensive applications.
• Low power consumption prolongs battery life in portable devices.
• Wide operating voltage range enhances compatibility.
• Robust packaging protects internal components.

Disadvantages

• Relatively higher cost compared to other memory technologies.
• Limited availability in certain markets due to specialized usage.

Working Principles

The CY7C1413KV18-250BZC operates based on the principles of static random access memory. It stores data in a matrix of flip-flops, which retain their state as long as power is supplied. The address inputs are used to select specific memory locations, while the control signals (WE#, OE#, CE#) determine read or write operations. The clock input (CLK) synchronizes data transfers in synchronous mode.

Detailed Application Field Plans

The CY7C1413KV18-250BZC finds applications in various fields, including:

1. Computer Systems: Used as cache memory to improve system performance.
2. Networking Equipment: Enables fast packet buffering and routing table storage.
3. Telecommunications Systems: Facilitates call processing and voice/data storage.
4. Industrial Automation: Supports real-time data acquisition and control systems.
5. Medical Devices: Provides reliable data storage for patient monitoring equipment.

Detailed and Complete Alternative Models

1. CY7C1413KV18-250BZI: Similar to the CY7C1413KV18-250BZC but packaged in an FBGA (Fine-Pitch Ball Grid Array) package.
2. CY7C1413KV18-250BZX: Offers extended temperature range (-40°C to +125°C) for harsh environment applications.
3. CY7C1413KV18-250BZXC: Includes additional ECC